Camtek Limited Product Line Delivers 100% Surface, Probe Mark and Bump Inspection of Finished Wafers in their Pre Sort, Post Sort or Post Dicing Stages. Integrating 2D and 3D Inspection, Measurement and Metrology Capabilities, Camtek Eagle and Condor Model are Focused on Advanced Packaging and Delivers the Versatility and Efficiency to Address all Visual Yield Assurance needs in one Compact Platform. Intelligent Auto Learning and Extensive Off Line Review and Recipe Setup Options Enhance the System's, Semiconductor Industry ...

Materials, Process; CMP, Grind, Lap, Polish, Abrasive materials; Disco; Disco Leads the Industry in Dicing, Grinding and Polishing; Technologies. Our Dicing Equipment is Comprised of Lasers; Singulation, Semi Automatic, Fully Automatic, Single And; Dual Spindle Saws. Materials we work with Include Silicon; Gaas, Low K, Ceramics, Glass and Others; Grinding Equipment Consists of Semi Automatic, And; Fully Automatic Grinders Capable of Ultra Thin Grinding; while Dry Polishers and Plasma Etchers Address, Grinding Machines ...