Majelac Technologies provides IC assembly services, including wafer dicing, die bonding and wire bonding. We offer QUICK TURNAROUND same day assembly service. Assembly Services to the Semiconductor & Optoelectronic Industries, Specializing in Quick Turn Assembly & Packaging, Package Capabilities Include, Ceramic, Plastic, Ball Grid Array ...

Bga Sockets, Standard & Custom Interconnect, Electronic Applications, Bristol Pennsylvania Usa, Ic Sockets, Adaptors, Adapters, Ball Grid Array, Bga Package Devices, Patented Csp Sockets, Terminals, Pga Packages, Dip Packages, Sip Packages, Board to Board, Plug Sockets, Electronic Plugs ...

Ocwhite, Oc, White, O, C, White, O.C.White, O.C. White, Micro, Lite, Microlite, Vision, Lite, Visionlite, Ultraflex, Uniflex, Exhaustmag, Exhaust, Mag, Exhaust, A, Lite, Exhaustalite, Prolite, Big, Eye, Machine, Lighting, Microphone, Arms, Illumination, Superscope, Super, Scope, 2000, Ball, Grid, Array ...