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Fineplacer Lambda Sub Micron Accuracy Bonder for Photonics Device Packaging and Assembly; Sub Micron Accuracy Bonders for Photonics Packaging and Assembly Laser Bars, Vcsels, Photo Diodes, Mems, Sensors, Leds, Flip Chip, Copper Pillar, High Process Flexibility within one Platform Makes These Systems Ideal for R&D, Prototype Environments. Manual, Motorized and Automated Models Accommodate Thermo Compression, Thermo Sonic, Eutectic, Epoxy, Acf & Indium Bonding. We Collaborate with Customers, Optics Equipment, Photonics, Transistors and Diodes