Materials, Process; CMP, Grind, Lap, Polish, Abrasive materials; Disco; Disco Leads the Industry in Dicing, Grinding and Polishing; Technologies. Our Dicing Equipment is Comprised of Lasers; Singulation, Semi Automatic, Fully Automatic, Single And; Dual Spindle Saws. Materials we work with Include Silicon; Gaas, Low K, Ceramics, Glass and Others; Grinding Equipment Consists of Semi Automatic, And; Fully Automatic Grinders Capable of Ultra Thin Grinding; while Dry Polishers and Plasma Etchers Address, Grinding Machines ...

We Think Laser, Lasers for Industry, the Mark of Excellence; the Ongoing Miniaturization of Electronics, Semiconductor and Medical Devices Opens Up Unique Possibilities for Lasers. Where Traditional Material Processes Reach their Limits, Lasers Open Up new Possibilities Due to Excellent Focussing and a Small Heat Affected Zone. Whether Metal, Plastics, Glass, Semiconductor Parts, Ceramics or Wood – Almost all Materials can be Marked with a Laser, with Speeds Up to 1,000 Characters Per Second. Today, Semiconductor Industry, Machine Parts ...