Sono Tek’s ultrasonic coating technology is used for applications in which material consumption, uniformity, repeatability, and control are required. Our ultrasonic technology is well known in the semiconductor industry for precision photoresist coatings. Sono Tek’s SPT200 photoresist coating machine is the perfect tool for providing uniform photoresist coverage of deep well topographies such as MEMs and other ...

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MEMS Equipment; Deep RIE etching, Dry Etching; Nanotechnology Equipment and Tools; Equipment, Nanotechnology Tools; Process Equipment; Deposition, (CVD, PVD, ALD, Plating); Etching, Stripping, Ashing Dry and Wet Equipment, Semiconductor Industry ...

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Packaging and Assembly Equipment; Cleaning, Washing Equipment for Assembly & Packaging; Wire Bonding Equipment; Molding, Encapsulation, Decapsulation Equipment; Vacuum drying & out gassing Systems; MEMS Equipment; Deep RIE etching, Dry Etching; Nanotechnology Equipment and Tools; Equipment, Nanotechnology Tools; PV Equipment; Wafers; Thin Film: Process Equipment; Cleaning, Washing Equipment for Assembly & Packaging; Coat, Develop, Resist Processing, Track Equipment; Deposition, (CVD, PVD, ALD, Assembly Equipment ...

MEMS Equipment; Deep RIE etching, Dry Etching; Double sided mask aligner; Wafer Level Bonders; Process Equipment; Cleaning, Washing Equipment for Assembly & Packaging; Deposition, (CVD, PVD, ALD, Plating); Etching, Stripping, Ashing Dry and Wet Equipment; Lithography, Exposure; Plating, Electro Chemical Plating, Deposition Systems, Semiconductor Industry ...

Mems Equipment; Thin Film; Deposition, Pvd, Sputtering, Evaporation Equipment; Nanotechnology Equipment & Tools; hing, Stripping, Ashing Dry & Wet Equipment; Process Equipment; Deposition & Cvd, Pvd, Ald, Plating; Deep Riehing, Dryhing; Equipment, Nanotechnology Tools; Ion, E Beam Millinghing Equipment ...

Packaging and Assembly Equipment; Dispensing Systems; Litho for WLP: Bumping, D Interconnect Aligners; Wafer Level Bonders; Flat Panel Display Equipment; Alignment Film Coating Equipment; Luminous Layer Patterning and Sealing Equipment; MEMS Equipment; Deep RIE etching, Dry Etching; Wafer Level Bonders; PV Equipment; Thin Film; Process Equipment; Bumping Systems; Cleaning, Washing Equipment for Assembly & Packaging; Coat, Develop, Resist Processing, Track Equipment; Deposition, (CVD, PVD, ALD, Semiconductor Components, Assembly Equipment ...