Lapping Machines, Lapping Machine, Polishing Machines, Polishing Machine, Optical Flat, Polish Flat, Checklite, Check Flat, Straight Edge & Filler Gauges, Lapping Consumables, Polishing Consumables, Cerium Oxide, Cerium Pads, Cerium Pads Valve Grinding Paste, Machine Tool, Cutting Wheels ...

Coating Line, Fiber Laser Cutting, Complete Automatic Production Line, Deep Drawing & Forming, Edge Cutting, Trimming & Beading, Cookware Washing Line, Cookware Induction Machine, Mirror Polish, Sunray Mat Finish, Big Size Polish, Outer Surface Polish, Inner Polish, Sanding Sunray Mat Finish, Bottom Spiral Lathing & Mouth Trimming, Punching & Riveting, Production Equipment ...

Continue to strive for leading the semiconductor production; Introduction of the original process `ROKKO puremium process` turned to the visitor troubled by knife edge or the cleanning factor on the back of a pattern (particle and contamination) while thinning processing of the wafer for power and sensors progressed, Back grind ojf 6 inch SiC and sapphire wafer, polish(CMP), proposal of washing technology, Semiconductor Industry ...