300 Materials, Assembly; Spin On Glass Material; Cmp, Grind, Lap, Polish, Abrasive Materials; Materials, Chemicals & Solids; Materials, Test; Surface Protection Material, Coatings; Materials, Process; Thick Film Pastes, Materials; Specialty Chemicals; Test Sockets, Contactors & Contact Accessories, Electronic Plugs ...

Continue to strive for leading the semiconductor production; Introduction of the original process `ROKKO puremium process` turned to the visitor troubled by knife edge or the cleanning factor on the back of a pattern (particle and contamination) while thinning processing of the wafer for power and sensors progressed, Back grind ojf 6 inch SiC and sapphire wafer, polish(CMP), proposal of washing technology, Semiconductor Industry ...