Fineplacer Lambda Sub Micron Accuracy Bonder for Photonics Device Packaging and Assembly; Sub Micron Accuracy Bonders for Photonics Packaging and Assembly Laser Bars, Vcsels, Photo Diodes, Mems, Sensors, Leds, Flip Chip, Copper Pillar, High Process Flexibility within one Platform Makes These Systems Ideal for R&D, Prototype Environments. Manual, Motorized and Automated Models Accommodate Thermo Compression, Thermo Sonic, Eutectic, Epoxy, Acf & Indium Bonding. We Collaborate with Customers, Optics Equipment, Photonics, Transistors and Diodes

Security, Holographic Security, the following products, 1) Scratch-off Labels: Non-Holographic, 2) Scratch-off Labels: Holographic, 3) Paper Label with Hologram & LASER/INKJET Serial Numbering, Bar Code, 4) Polyester Label with Color Printing, 5) Holographic Induction Sealing WAD, 6) Shrink Sleeve with Hologram, 7) Labels for Pen – Tamper Evident & Non-Tamper, Origination Technology, a) Flip, b) 2D/3D, c) Digital, d) Dot-Matrix, e) e-Beam ...

Projector Accessories Office Electronics Presentation Equipment Digital Projectors Lcd Dlp Video Ohp Over Head Interactive White Boards Ceiling Mount Lift Motorised Projection Screen Wall Mounted Instalok Portable Tripod Fixed V Cables and Connectors Wireless Presenter Cum Laser Pointer Installation Integration Chalk Board Black Green Writing Ceramic Magnetic Notice Pin Up Display Perforated Grooved Welcome Exhibition Fluorescent Revolving Flip Char ...