Fineplacer Lambda Sub Micron Accuracy Bonder for Photonics Device Packaging and Assembly; Sub Micron Accuracy Bonders for Photonics Packaging and Assembly Laser Bars, Vcsels, Photo Diodes, Mems, Sensors, Leds, Flip Chip, Copper Pillar, High Process Flexibility within one Platform Makes These Systems Ideal for R&D, Prototype Environments. Manual, Motorized and Automated Models Accommodate Thermo Compression, Thermo Sonic, Eutectic, Epoxy, Acf & Indium Bonding. We Collaborate with Customers, Optics Equipment, Photonics, Transistors and Diodes

Safety Equipment, Transistors and Diodes, Baskets; Booths; Chemicals; Cleaning Compounds and Chemicals; Coatings; Curing Systems; Deoxidizers; Disposal Equipment; Dyes; Filters; Finishing Equipment; Liners; Masks; Packaging Materials; Panels; Plating Solutions; Pumps; Racks; Rectifiers and Diodes; Safety Equipment; Tanks; Treatment Equipment; Valves ...

Tft LCD, Chip Resistor, Chip Capacitor Type, Release Liner, Esd, Emi Die Cutting, Pe Protective Film Tape, Packaging of Electronic Diodes, Cover Tape, Pcb Smt Insulating and Pi Industry, Transformer, Motor, Coil, Electric Wire, Masking Tape, Camera Accessories, Capacitors, Industrial Packaging, Transistors and Diodes ...