Materials, Substrate; Compound Semiconductor substrates (GaAs on Silicon, GaN, InP, SiGe,); Prime, Polished, Mirrored Wafers; Silicon on Insulator (SOI), Silicon on Sapphire (SOS), Silicon Carbide, Semiconductor Industry ...

Inspection & Measurement Products; Metrology, Topology, Nanotopography, Flatness, Cryst.Orient; PV Equipment; Wafers; Process Equipment; Wafer Identification, Marking Equipment; Mask Making Materials; Mask plate blanks, Glass; PV Materials; Ingots, Wafers; Process Materials; Quartzware, Ceramic & Oxide Ceramic Fixtures; Substrates; Prime, Polished, Mirrored Wafers; Thin & Thick film substrates for MEMS; Sub-systems; Optics, Lens Products, Auto-Focus Systems ...

Precision Ultrasonic Machining, Microabrasive Jet Machining, and CNC Grinding of Advanced Materials Including Cvd Sic, Sapphire, Alumina, Silicon, Quartz, Glass, Ceramic Composites; Hard & Brittle Materials. Structured Wafers for Mems Applications Including Mems Pressure Sensors and Microfluidic Applications. Single and Double Side Polished Borosilicate Wafers. Prototype Thru Production. Advanced Metrology Capabilities. Iso 9001:2008, Sensor and Transducer ...

MicroSense Precision Wafer Measurement Systems; MicroSense UltraMap – the New Standard for 200mm Polished Wafer Flatness Measurement; the new MicroSense UMA C200L wafer metrology system measures the flatness, thickness and shape of bare 200mm silicon wafers with industry leading throughtput, 32% higher than legacy systems. the UltraMap system provides; Industry standard dual capacitance sensor measurement ...