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Compound Semi Substrates & Gaas, Gan, Inp, Sige; Components, Parts; Sensors; Substrates; Chucks for Wafer, Substrates; Thin & Thick Film Substrates for Mems; Piezo Electronic Components ...
Continue to strive for leading the semiconductor production; Introduction of the original process `ROKKO puremium process` turned to the visitor troubled by knife edge or the cleanning factor on the back of a pattern (particle and contamination) while thinning processing of the wafer for power and sensors progressed, Back grind ojf 6 inch SiC and sapphire wafer, polish(CMP), proposal of washing technology, Semiconductor Industry ...
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New and Used Semiconductor Equipment Sellers. Assembly/SMT equipment, Refurbishment, Valutations, Auctions, Complete Wafer Fabs. Assembly Machinery; Generators; Grinders; Motherboards; Polishers; Processors; Pumps; Sensors, Detectors, Transducers; Surface Mount Components; Testers; Wafer Probers ...